SK Group and TSMC chairmen agree to deepen cooperation in the fields of HBM and advanced packaging

Both parties have agreed to further expand cooperation in areas such as next-generation HBM development and advanced packaging. In the future, the two companies plan to accelerate relevant work and strengthen their competitiveness in the customized AI memory market to meet the increasingly diverse and growing needs of global large technology company clients. Through its collaboration with TSMC, SK Hynix will seek to bring high-performance products to the market at an appropriate time.