Hanwha Investment&Securities Plans KRW 21.5 Billion Equity-Linked Bond Offering

Bitget2026/10/28 01:44

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Hanwha Investment&Securities plans a KRW 21.5 billion offering of equity-linked bonds backed by its credit, linked to Samsung Electronics common shares.
The Smart ELB Series 1255 bonds will be issued October 30, 2026, maturing October 29, 2027.
Annualized maturity returns are approximately 4.32%, with subscriptions restricted to retirement pension funds.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Hanwha Investment&Securities Co. Ltd. published the original content used to generate this news brief via DART, the regulatory disclosure system operated by the South Korea Financial Supervisory Service (FSS) (Ref. ID: 20261028000118), on October 28, 2026, and is solely responsible for the information contained therein.

Disclaimer: The content of this article solely reflects the author's opinion and does not represent the platform in any capacity. This article is not intended to serve as a reference for making investment decisions.

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Hanwha Investment&Securities Plans KRW 21.5 Billion Equity-Linked Bond Offering

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