Applied Materials, Besi expand strategic partnership on next-generation advanced packaging for AI chips

Bitget2026/10/01 13:03

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Applied Materials expanded its strategic partnership with Besi to develop next-generation advanced packaging technology for AI-driven chip scaling.
Besi joined Applied’s EPIC Center as an innovation partner, broadening joint R&D beyond die-to-wafer hybrid bonding.
Work targets 3D IC scaling, tighter logic-memory integration, photonics interconnects, thermocompression bonding scaling, new die-on-wafer and panel architectures.
Collaboration builds on a 2020 Singapore program that produced Kinex, an integrated die-to-wafer hybrid bonding system.
Applied’s EPIC Center investment was pegged at USD 5 billion, intended to speed commercialization from research to high-volume manufacturing.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Applied Materials Inc. published the original content used to generate this news brief via GlobeNewswire (Ref. ID: 202610010900PRIMZONEFULLFEED9837493) on October 01, 2026, and is solely responsible for the information contained therein.

Disclaimer: The content of this article solely reflects the author's opinion and does not represent the platform in any capacity. This article is not intended to serve as a reference for making investment decisions.

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Applied Materials, Besi expand strategic partnership on next-generation advanced packaging for AI chips

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