LG Electronics partners with SK Enmove to develop next-generation cooling materials for AI data centers
Bitget2026/09/23 01:05- LG Corp. unit LG Electronics signed an MOU with SK Enmove to co-develop next-generation thermal-management materials for AI data centers.
- Scope covers new refrigerants, compressor lubricants, immersion-cooling fluids, targeting tighter environmental rules plus higher cooling efficiency.
- Parties will develop PFAS-free refrigerants with GWP below 150, aiming to meet emerging US, European requirements.
- Collaboration expands existing immersion-cooling work, evaluating applications beyond data centers such as energy storage systems, EV components.
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