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Xu Guojin, Vice President of Advanced Packaging Technology Development at TSMC, stated today that the underlying architecture of optical transceivers is undergoing a structural transformation, with silicon photonics becoming the mainstream type. It is expected that by 2027, market share could exceed 50%. The ultimate form of silicon photonics is Co-Packaged Optics (CPO), and some manufacturers are expected to begin mass production in the second half of this year.

Xu Guojin, Vice President of Advanced Packaging Technology Development at TSMC, stated today that the underlying architecture of optical transceivers is undergoing a structural transformation, with silicon photonics becoming the mainstream type. It is expected that by 2027, market share could exceed 50%. The ultimate form of silicon photonics is Co-Packaged Optics (CPO), and some manufacturers are expected to begin mass production in the second half of this year.

智通财经智通财经2026/08/31 03:56
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TSMC Deputy General Manager of Advanced Packaging Technology Development, Xu Guojin, stated today that the underlying architecture of optical transceivers is undergoing a structural transformation, with silicon photonics becoming the mainstream technology. It is expected that by 2027, the market share of silicon photonics will exceed 50%, and its ultimate application will be co-packaged optics (CPO). Manufacturers are expected to begin mass production in the second half of this year.
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