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SK Hynix Inc. held a groundbreaking ceremony for its advanced memory packaging plant in Indiana, USA, marking a significant milestone in Washington's efforts to rebuild domestic supply chains and manufacturing. The West Lafayette facility will become SK Hynix's first high-bandwidth memory (HBM) packaging base in the US, with its clean room expected to open in October 2028 and mass production slated to begin in the second half of 2029. The Indiana project is supported by the US CHIPS and Science

SK Hynix Inc. held a groundbreaking ceremony for its advanced memory packaging plant in Indiana, USA, marking a significant milestone in Washington's efforts to rebuild domestic supply chains and manufacturing. The West Lafayette facility will become SK Hynix's first high-bandwidth memory (HBM) packaging base in the US, with its clean room expected to open in October 2028 and mass production slated to begin in the second half of 2029. The Indiana project is supported by the US CHIPS and Science

智通财经智通财经2026/08/27 15:21
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SK Hynix Inc. held a groundbreaking ceremony for its advanced memory packaging plant in Indiana, USA, marking a significant milestone in Washington’s efforts to rebuild domestic supply chains and manufacturing. The West Lafayette plant will be SK Hynix’s first high-bandwidth memory (HBM) packaging facility in the United States, with its clean room expected to open in October 2028 and mass production scheduled to begin in the second half of 2029. The Indiana project has received support from the US CHIPS and Science Act, is expected to create job opportunities and strengthen the US domestic AI chip supply chain, and SK Hynix plans to expand its investment and cooperation in the United States.
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