Qnity Launches Materials Platform for Advanced Chip Packaging

07:12 AM EDT, 08/25/2026 (MT Newswires) -- Qnity (Q) has launched a scalable materials platform integrating technologies to package advanced semiconductors, the company said Tuesday. The platform supports 2.5D and 3D chip designs, as well as panel-level architectures, and includes solutions for copper plating, micro-bumps, dielectric materials and fine-line patterning, the company said. Qnity said the platform can support metallization with line and space widths as small as 2 microns. Qnity will present the platform at the Heterogeneous Integration Global Summit during SEMICON Taiwan 2026 on Sept. 1, according to the company. Shares of the company were 1.8% higher in Tuesday premarket activity.