Applied Materials launches a series of 3D manufacturing devices for AI chips, targeting HBM stacking technology.

```htmlGolden Ten Data reported on June 30 that Applied Materials has unveiled a product line of three-dimensional (3D) chip manufacturing equipment designed for AI semiconductor applications. This series of equipment mainly focuses on flatness, deposition, and metrology detection required by advanced packaging processes such as high bandwidth memory (HBM), Chiplet, and Hybrid Bonding. Specifically, the newly announced equipment includes advanced Chemical Mechanical Polishing (CMP), Electrochemical Vapor Deposition (ECD), and Plasma-Enhanced Chemical Vapor Deposition (PECVD) devices for the packaging sector. It also introduces process control devices based on electron beams and upgrades its epitaxial equipment used for DRAM processes.```