Qualcomm plans to bring data center chip technology to smartphones to enhance on-device AI capabilities

Glonghui, June 27 — Qualcomm Executive Vice President Durga Malladi stated that the company plans to apply the newly released data center chip technology announced this week to smartphones, in order to enhance local AI capabilities on mobile devices. Qualcomm’s newly launched High Bandwidth Computing (HBC) architecture adopts a vertically stacked chip design, closely integrating memory and compute units, which can significantly improve data transmission speed and efficiency. The first generation of this architecture will be launched in data centers next year and is expected to be commercially available in 2028. Malladi said, “The technology from data centers will not stop here.” The company is currently in talks with smartphone, PC, and automobile manufacturers regarding the relevant technology.