TrendForce: This year is expected to be a key validation period for TSMC’s CoPoS equipment and materials, with glass substrates likely to enter mass production after 2030.

```htmlGolden Ten Data reported on June 17 that TrendForce's latest report indicates that TSMC is currently focused on CoPoS and targeting a substrate size of 310×310 mm. 2026 is expected to be a critical validation period for related equipment and material suppliers, with pilot production starting in 2027 and official mass production in the second half of 2028. In addition, TSMC's next stage of planning is expected to shift toward glass substrates, with mass production potentially commencing after 2030.```