Prominent Analyst: TSMC's Next-Generation Advanced Packaging Technology Expected to Begin Mass Production in the Second Half of 2028

BlockBeats News, June 11th - Analyst Ming-Chi Kuo from TF International Securities published an article stating that TSMC's next-generation advanced packaging technology, CoWoS, is expected to enter mass production in the second half of 2028. It is designed for ultra-large-scale packaging exceeding 9.5 times the reticle size, and NVIDIA's Feiman AI chip may become the first adopter.

CoWoS adopts a glass core substrate structure, sandwiching glass between ABF build layers using glass carriers and panels of a specific size. The glass serves as neither a glass interposer nor a replacement for ABF. The chip is bonded on the ABF surface, clarifying several industry misunderstandings.

Public information shows that CoWoS offers a larger panel platform and space, making it ideal for integrating the CPO's optical elements (such as light engines and couplers). Future high-end AI packaging may potentially adopt both CoWoS (large substrates) and CPO (optical I/O) to form a complete solution.