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SK Hynix introduces additional equipment for the P&T6 plant to meet HBM4 packaging and testing demands

SK Hynix introduces additional equipment for the P&T6 plant to meet HBM4 packaging and testing demands

格隆汇格隆汇2026/06/09 04:33
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GLONGHUI June 9th|SK hynix is introducing additional equipment to its Cheongju P&T6 packaging and testing plant to meet the packaging and testing demand for sixth-generation high-bandwidth memory (HBM4). The plant is expected to start mass production in the first quarter of next year and will operate in coordination with the Cheongju DRAM wafer fab M15X.
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