SK Hynix reportedly plans to double DRAM wafer capacity by 2030

⑴ According to reports, SK Hynix has shared its mid-to-long-term expansion plan with major partner companies to double its DRAM wafer production capacity between 2030 and 2031 compared to current levels. ⑵ Notably, preparations for this plan began earlier than NVIDIA CEO Jensen Huang's request to "produce more," written at the COMPUTEX exhibition. ⑶ The report states that about two months ago, SK Hynix's procurement department and the Yongin semiconductor cluster head started informing key suppliers of this wafer input-based production expansion plan. The core goal of the plan is to increase the current monthly DRAM production capacity of approximately 550,000 wafers to around 1 million wafers per month by 2030.