TSMC plans to start trial production of advanced process below 1nm in 2029, with Apple expected to be the first to adopt it

TSMC is pushing semiconductor manufacturing processes to new limits. According to reports, the world’s largest chip foundry has included sub-nanometer processes in its mass production roadmap, with pilot production expected in 2029. Apple is highly likely to be among the first customers.

According to DigiTimes, while TSMC continues advancing mass production of its 2-nanometer process, the company has already mapped out a comprehensive technology roadmap covering both mainstream and cutting-edge manufacturing processes.

According to this roadmap, TSMC plans to begin large-scale mass production of its 1.4-nanometer process (codenamed A14) in 2028, a process that is expected to achieve up to 30% improvements in both performance and energy efficiency. Sub-nanometer process pilot production will then follow in 2029, with an initial monthly target of 5,000 wafers.

This technology pathway is significant for Apple. Apple is expected to launch the iPhone 18 series equipped with 2nm chips this year, marking the debut of TSMC’s A20 and A20 Pro processes. If the sub-nanometer process progresses as scheduled, Apple could integrate this cutting-edge technology into its flagship product lines within a few years, maintaining its generational lead in the mobile chip sector.

Roadmap Emerging: From 2nm to Sub-Nanometer

TSMC’s current technology roadmap is clearly delineated.

Mass production of the 2nm process is underway to meet the demands of major customers including Apple; fulfillment plans for orders at the 1.6nm node (codenamed A16) are already in place; by 2028, the 1.4nm process will enter mass production, promising significant dual improvements in performance and energy consumption.

The sub-nanometer process, however, represents the most formidable technical challenge on this roadmap. The reports have not identified potential customers for this ultra-advanced process, but given Apple and TSMC’s long-term exclusive partnership, it is widely expected that Apple will be among the early adopters.

Capacity Deployment: Multi-Fab Coordination to Support Pilot Production

To advance the sub-nanometer process, TSMC plans to mobilize its A10 fab in Tainan and collaborate with four facilities (P1 through P4) to collectively operate and achieve an initial monthly output goal of 5,000 wafers.

Meanwhile, the ongoing surge in demand for artificial intelligence chips has already placed pressure on TSMC’s production capacity, providing an added incentive for the company to accelerate adjustments in production schedules and secure orders ahead of time.

The robust market demand for iPhone cannot be overlooked either—historical experience shows that Apple has previously paid a premium to secure priority supply rights, a scenario that may repeat itself during the initial batches of sub-nanometer process chips.

Yield Challenges: Tough Battles Remain Before Mass Production

Despite the clear roadmap, whether TSMC can achieve stable sub-nanometer process mass production on schedule still hinges on resolving yield issues.

Currently there is a market rumor that, under yield pressure, smartphone manufacturers are forced to adopt downgraded chip solutions for flagship models, reserving the most advanced process chips for "Ultra" series high-end devices.

If this trend materializes, it would directly impact product positioning strategies—consumers may have to pay a higher premium for devices equipped with top-tier process chips, rather than seeing this as a standard flagship configuration.

For investors, whether TSMC can effectively manage yields while expanding capacity will be a critical variable in assessing its long-term profitability.