Broadcom delivers new custom AI chip design to Fujitsu
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Gelonghui, February 26｜Broadcom has delivered a brand new customized artificial intelligence chip design to Fujitsu, utilizing stacked components to save energy, and it is expected that large data center operators will adopt this technology later this year. Harish Bharadwaj, Vice President of Marketing for the company's custom chip division, stated that the stacked design can achieve higher data throughput while improving energy efficiency.
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