SK Hynix is developing new technology to reduce NAND manufacturing costs
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Gelonghui, February 11th｜SK Hynix is developing an innovative technology called "AIP (All-In-Plug)" to alleviate the cost increases caused by the growing number of stacked layers. It is reported that traditional manufacturing methods require etching multiple NAND layers separately and connecting them through a bonding process, while AIP aims to significantly reduce manufacturing costs by etching all NAND layers at once.
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